3H Solution

Back End Solution

  • Back End Solution
Wafer Thinning
Wafer Mounting
Wafer Dicing
Wafer Expanding
Die Bonding
Wire Bonding
Micro Dispensing
Lead Frame Forming
Laser Marking
Wafer Thinning
Wafer Mounting
Wafer Dicing
Wafer Expanding
Die Bonding
Wire Bonding
Micro Dispensing
Lead Frame Forming
Laser Marking
  • Wafer Thinning
  • Wafer Mounting
  • Wafer Dicing
  • Wafer Expanding
  • Die Bonding
  • Wire Bonding
  • Micro Dispensing
  • Lead Frame Forming
  • Laser Marking

Company Info.

  • ㈜쓰리에치코퍼레이션
  • 본사 : 경기도 성남시 분당구 서현로 257번길 12, 3H 슈필라움 빌딩
  • 공장 : 경기도 성남시 중원구 사기막골로 45번길 14, B-1610
  • 2F, 12 Seohyeon-ro 257beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-go, 13572, Korea
  • TEL : +82(0)31-721-0740 | FAX : +82(0)31-721-0741
  • E-MAIL : sales@3htech.co.kr
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